IEC 62830-5:2021 pdf download-Semiconductor devices – Semiconductor devices for energy harvesting and generation.
Also, the amount of generated power from flexible thermoelectric devices can be different according to the temperature, temperature difference, and contact conditions. This is due to the fact that there should be a discrepancy in the temperature between the surface of the cooling or heating side and the surface of the device. This discrepancy is dependent on the contact conditions. The contact conditions between the surface of the device and the surface of the cooling or heating side can be characterized by measuring the contact pressure in the case of a rigid type thermoelectric device. In contrast, in the case of a flexible device, the contact pressure can vary greatly depending on the package type or material of the flexible thermoelectric device. Hence, it is strongly recommended that the description of the package type, structure, dimension of the device including the distance between the cooling and heating side, be included in the report. A detailed experimental set-up for measuring contact pressure is described in Clause A.2 as an example. Table 2 summarizes those parameters and Table 3 shows the performance parameters of the thermoelectric device including the conditions of the experimental set-up. In addition, an example of experimentally determined generated power under different conditions is presented in Clause A.3.
Both the thickness of the sample and the distance between the heating and cooling sides are important parameters. In general, the generated power is dependent on the contact pressure between the sample and the heating or cooling side. However, unlike a flat type thermoelectric device whose surface is rigid, the surface of the flexible thermoelectric device is easily deformed by the contact pressure. Therefore, in the case of a flexible thermoelectric device, it is better to report the distance between the hot and cold sides instead of the contact pressure, including the description of the package structure of the flexible device.