IEC 61837-3:2000 pdf download-Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 3: Metal enclosures.
1 Scope This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 61837. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 61837 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 61240:1994, Piezoelectric devices – Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection – General rules 3 Configuration of enclosures The enclosures of the surface-mounted devices are made of metal with the formed lead terminals based on the descriptive designation system for semiconductors – devices package. The configuration symbols are shown as follows: – DCC (dual chip carrier); – QCC (quad chip carrier); – SS (special surface-mounted).
5 Metal enclosure dimensions The dimensions given in this standard apply to all the completed SMD for frequency control and selection. Only those dimensions are given which meet the requirements of IEC 61240. 6 Lead connections Recommendations for the lead connections of all completed SMD for frequency control and selection, except SS-types, are given in the following individual sheets. Lead connections shall always be given in the detail specification. 7 Designation of metal enclosures The following table sets out the designation of the metal enclosures as outlined in the ensuing specification sheets.