IEC 60317-35:2000 pdf download-Specifications for particular types of winding wires – Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer.
17 Solderability 17.1 Nominal conductor diameters up to and including 0,050 mm The temperature of the solder bath shall be 390 °C ± 5 °C. The maximum immersion time shall be 2 s. The surface of the tinned wire shall be smooth and free from holes and enamel residues. 17.2 Nominal conductor diameters over 0,050 mm up to and including 0,100 mm The temperature of the solder bath shall be 390 °C ± 5 °C. The maximum immersion time shall be 2 s. The surface of the tinned wire shall be smooth and free from holes and enamel residues. 17.3 Nominal conductor diameter over 0,100 mm The temperature of the solder bath shall be (390 ± 5) °C. The maximum immersion time (in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres) with a minimum of 2 s.
The surface of the tinned wire shall be smooth and free from holes and enamel residues. 18 Heat or solvent bonding NOTE Solvent bonding: test required but not yet under consideration. 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil 18.1.1.1 At room temperature The specimens shall be prepared according to the test method, and the temperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (200 ± 2) °C and the suggested temperature for polyvinyl butyral bonding enamel is (170 ± 2) °C. Results: when testing the specimens according to the test method, under the action of load specified in table 2, no turns other than possibly the first and the last shall be separated. 18.1.1.2 At elevated temperature The specimens shall be prepared and shall be conditioned as described in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (155 ± 2) °C and the suggested temperature for polyvinyl butyral bonding enamel is (90 ± 2) °C.